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Assembly of printed circuit boards according to IPC-A-610 standard
Machine mounting of SMD components.
Equipment: solder paste printer FUJI GPX, pick and place machines FUJI AIM (smallest component 0201) and QSP-2plus.
• Soldering of SMD components using reflow oven and wave soldering machine in a nitrogen environment.
• Automatic Optical Inspection (AOI) of mounted SMD components with OMRON VT RNS-S.
• THT components manual placing and wave soldering with SEHO 8135 PCS.
• PCB washing and protective coating.
• Assembled PCBs electrical testing and setup according to clients instructions.